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BI Technologies - Hybrid Microcircuits
Hybrid microcircuits provide an ideal technology when space, quality, and performance are required and volumes don’t justify an expensive ASIC solution. Whether you need hermetically sealed MIL-PRF 38534 Class H, value engineered all in one 3kW power modules, or environmentally robust commercial hybrids BI Technologies has your solution.

Hybrid Microcircuits Index –


High Reliability Hybrids

Application Notes
MODEL
DESCRIPTION
ASSEMBLY
PACKAGE
SUBSTRATE
OPERATING TEMPERATURE
165
Series
Custom
Hybrid
Microcircuit
or MCM
Epoxy Mounted Die
Substrate w/Integral
Resistors,
Gold or AL Bonds
Hermetic Metal,
Ceramic,
Plastic
Encapsulated
Thick Film,
Thin Film
-55C to +125C
Optional: Up to
+200
Applications: Avionic Systems, Communication Guidance/Control Systems,
                   Medical Implantables, High Temperature , Environments


Power Modules

MODEL
DESCRIPTION
ASSEMBLY
PACKAGE
SUBSTRATE
OPERATING TEMPERATURE
170
Series
Custom Module,
Power Switching
up to 500 Amp
Peak
Solder Mounted Die,
High Current Traces
Insulated Backplate
Heavy Gage Al Bonds
Encapsulated, Integral Mounting Flange Direct Bond
Copper (DBC)
or Insulated Metal (IMS)
-40C to +125C
7700
Series
Standard
20 Amp, 25 Amp
Power Factor
Correction
Module (PFC)
7720
Series
Standard 10 Amp,
15 Amp, 20
Amp Power Factor
Correction
Module (PFC)

7721
Series

22 Amp, 32 Amp
H-Bridge Modules
w/Thermal
Protection
Applications: Power Supplies, Motor Drive/Controls, DC/DC Converters, UPS, Audio Amplifiers





Commercial Hybrids

MODEL
DESCRIPTION
ASSEMBLY
PACKAGE
SUBSTRATE
OPERATING TEMPERATURE

143
Series

Custom module

Surface Mount
Components
Single or Multilayer
substrate
w/Integral
Resistors
Open Frame
Conformal Coated
Encapsulated
Polymer Housing
SIP, DIP, or SMT
Thick Film
Ceramic
0°C to +70°C
(Standard:)
-25°C to +85°C
(Optional:)

143-131A

Temperature Compensation module

Surface Mount Components substrate w/Integral Resistors Open Frame
SIP
Thick Film Ceramic -40°C to +80°C
(Standard:)
Applications: Industrial, Automotive, Portable Electronics, White Goods, Telecommunications